Flexible display apparatus and manufacturing method thereof

ABSTRACT

A flexible display apparatus including a flexible display panel, a flexible circuit board, a driving chip, and a sealing layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The flexible circuit board is disposed in the bonding area of the flexible display panel. The driving chip is disposed on the flexible circuit board. The sealing layer encapsulates a periphery of the flexible display panel and extendedly covers the bonding area and a portion of the flexible circuit board.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation-in-part application of and claims thepriority benefit of a prior application Ser. No. 13/950,303, filed onJul. 25, 2013, now allowed. The prior application Ser. No. 13/950,303claims the priority benefit of Taiwan application Ser. No. 101144165,filed on Nov. 26, 2012. The entirety of each of the above-mentionedpatent applications is hereby incorporated by reference herein and madea part of this specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a display apparatus and a manufacturing methodthereof, and more particularly to a flexible display apparatus and amanufacturing method thereof.

2. Description of Related Art

With rapid development of display technologies, conventional cathode raytube (CRT) displays have been gradually replaced by flat panel displays(FPD). In comparison with the FPD formed by a rigid substrate (e.g. aglass substrate), a flexible display in which an active device is formedon a flexible substrate has been developed according to recentresearches because the flexible substrate (e.g. a plastic substrate or ametal thin plate) is characterized by flexibility and impact endurance.

Generally speaking, if an active device is to be formed on a flexiblesubstrate, the flexible substrate is often adhered to the rigidsubstrate, and then a series of transistor manufacturing process (a scanline, data line, pixel unit, storage capacitor, gate insulation layer,protection layer, and etc.) can be performed to form a flexible displaypanel. Thereafter, a driving chip (e.g. a scan driving chip and a datadriving chip) is disposed on a trace layer in a periphery area of theflexible display panel by chip on glass (COG) bonding technique to beelectrically connected to the driving chip and the flexible displaypanel. After all the processes are completely performed, the flexibledisplay panel is removed from the rigid substrate.

However, since a pin of the driving chip has rigidity and is notflexible, when removing the flexible display panel from the rigidsubstrate, the pin of the driving chip is likely to be broken or thetrace layer in the periphery area of the flexible display panel islikely to have a broken line or a break, causing a defect in the panelor reducing the reliability of the flexible display.

SUMMARY OF THE INVENTION

The invention provides a flexible display apparatus having a betterreliability.

The invention provides a manufacturing method of a flexible displayapparatus for manufacturing the aforementioned flexible displayapparatus.

The invention provides a flexible display apparatus, including aflexible display panel, a flexible circuit board, a driving chip, and asealing layer. The flexible display panel has a display area and abonding area located outside the display area. The flexible circuitboard is disposed in the bonding area of the flexible display panel. Thedriving chip is disposed on the flexible circuit board. The sealinglayer encapsulates a periphery of the flexible display panel andextendedly covers the bonding area and a portion of the flexible circuitboard.

In one embodiment of the invention, the flexible display apparatusfurther includes an anisotropic conductive film disposed between theflexible circuit board and the bonding area of the flexible displaypanel, wherein the flexible circuit board is electrically connected tothe flexible display panel via the anisotropic conductive film.

In one embodiment of the invention, the anisotropic conductive filmincludes an adhesive and a plurality of conductive particles. Theconductive particles are distributed in the adhesive, wherein a diameterof each of the conductive particles ranges from 1 nm to 5 nm.

In an embodiment of the invention, a location of the driving chip doesnot overlap with a location of the flexible display panel.

In an embodiment of the invention, the flexible display apparatusfurther includes an external circuit connected to the flexible circuitboard; the flexible display panel is electrically connected to theexternal circuit via the flexible circuit board.

In an embodiment of the invention, the flexible display apparatusfurther includes a protective layer disposed on a bottom surface of theflexible display panel and covering the bottom surface.

In an embodiment of the invention, the flexible display apparatusfurther includes a protective layer disposed on a top surface of theflexible display panel, and the sealing layer covering the flexiblecircuit board and the protective layer.

The invention further provides a flexible display apparatus, including aflexible display panel, a flexible circuit board, a driving chip, and ahot-melt protective layer. The flexible display panel has a display areaand a bonding area located outside the display area. The flexiblecircuit board is disposed in the bonding area of the flexible displaypanel. The driving chip is disposed on the flexible circuit board. Thehot-melt protective layer covers the display area and the bonding areaof the flexible display panel and a portion of the flexible circuitboard.

In an embodiment of the invention, the flexible display apparatusfurther includes an anisotropic conductive film disposed between theflexible circuit board and the bonding area of the flexible displaypanel, wherein the flexible circuit board is electrically connected tothe flexible display panel via the anisotropic conductive film.

In an embodiment of the invention, the anisotropic conductive filmincludes an adhesive and a plurality of conductive particles. Theconductive particles are distributed in the adhesive, wherein a diameterof each of the conductive particles ranges from 1 nm to 5 nm.

In an embodiment of the invention, a location of the driving chip doesnot overlap with a location of the flexible display panel.

In an embodiment of the invention, the flexible display apparatusfurther includes an external circuit connected to the flexible circuitboard, wherein the flexible display panel is electrically connected tothe external circuit via the flexible circuit board.

In an embodiment of the invention, the flexible display apparatusfurther includes a protective layer disposed on a bottom surface of theflexible display panel and covering the bottom surface.

In an embodiment of the invention, a material of the protective layerincludes polyethylene terephthalate (PET).

In an embodiment of the invention, a material of the hot-melt protectivelayer includes polyethylene terephthalate mixed with a hot-meltmaterial, a weight percentage of the hot-melt material is 30% to 60%,and the hot-melt material includes Polyurethane (PU) or Ethylene-VinylAcetate (EVA).

The invention further provides a manufacturing method of a flexibledisplay apparatus, including steps of providing a substrate, forming aflexible display panel on the substrate, wherein the flexible displaypanel has a display area and a bonding area located outside the displayarea, bonding a driving chip on the bonding area of the flexible displaypanel via at least one flexible circuit board, forming a hot-meltprotective layer on the display area and the bonding area of theflexible display panel and a portion of the flexible circuit board,performing a heating step to soften the hot-melt protective layer, andseparating the flexible display panel from the substrate.

In an embodiment of the invention, the step of forming the flexibledisplay panel on the substrate includes forming an adhesive layer on thesubstrate, and forming the flexible display panel on the substrate,wherein the flexible display panel is adhered to the substrate via theadhesive layer.

In an embodiment of the invention, the driving chip is disposed on theflexible circuit board, and a location of the driving chip does notoverlap with a location of the flexible display panel.

In an embodiment of the invention, the flexible circuit board is bondedto the bonding area of the flexible display panel via an anisotropicconductive film.

In an embodiment of the invention, the manufacturing method of theflexible display apparatus further includes bonding an external circuitto the flexible circuit board after separating the flexible displaypanel from rigid substrate, wherein the flexible display panel iselectrically connected to the external circuit via the flexible circuitboard.

In an embodiment of the invention, a temperature of the heating step isbetween 70° C. and 140° C.

In an embodiment of the invention, the manufacturing method of theflexible display apparatus further includes bonding a protective layerto a bottom surface of the flexible display panel after separating theflexible display panel from the substrate.

Based on the above, since the flexible display apparatus in theembodiments of the invention adopts a chip on film (COF) technique thatallows the driving chip to be disposed on the flexible display panel,the driving chip disposed on the flexible circuit board is not bendedeasily (the flexible circuit board is the one bended by stress).Therefore, the situation in which the pin of a conventional driving chipis broken may be avoided. In addition, since the flexible displayapparatus in the embodiments of the invention has a sealing layer or ahot-melt protective layer, when separating the flexible display panelfrom the rigid substrate, the sealing layer or the hot-melt protectivelayer may reinforce a structure strength between the flexible displaypanel and the flexible circuit board so as to further enhance an overallstructural reliability of the flexible display apparatus.

In order to make the aforementioned features and advantages of theinvention more comprehensible, embodiments accompanying figures aredescribed in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide further understanding,and are incorporated in and constitute a part of this specification. Thedrawings illustrate exemplary embodiments and, together with thedescription, serve to explain the principles of the invention.

FIG. 1A illustrates a schematic cross-sectional view of a flexibledisplay apparatus in an embodiment of the invention.

FIG. 1B illustrates a schematic top view of the flexible displayapparatus in FIG. 1A.

FIG. 2 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention.

FIG. 3 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention.

FIG. 4 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention.

FIG. 5 illustrates a schematic top view of a flexible display apparatusin another embodiment of the invention.

FIG. 6 illustrates a schematic top view of a flexible display apparatusin another embodiment of the invention.

FIG. 7A illustrates a schematic cross-sectional view of a flexibledisplay apparatus in an embodiment of the invention.

FIG. 7B illustrates a schematic top view of the flexible displayapparatus in FIG. 7A.

FIGS. 8A to 8E illustrate a schematic cross-sectional view of amanufacturing method of a flexible display apparatus in an embodiment ofthe invention.

FIG. 9 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention.

FIG. 10 illustrates a schematic top view of a flexible display apparatusin another embodiment of the invention.

FIG. 11 illustrates a schematic top view of a flexible display apparatusin another embodiment of the invention.

DESCRIPTION OF EMBODIMENTS

FIG. 1A illustrates a schematic cross-sectional view of a flexibledisplay apparatus in an embodiment of the invention. FIG. 1B illustratesa schematic top view of the flexible display apparatus in FIG. 1A. Withreference to both to FIGS. 1A and 1B, a flexible display apparatus 100 ain the embodiment includes a flexible display panel 120, at least onedriving chip 130, at least one flexible circuit boards 140, and asealing layer 160. The flexible display panel 120 has a display area 121and the bonding area 123 located outside the display area 121. Theflexible circuit boards 140 are disposed in the bonding area 123 of theflexible display panel 120. The driving chips 130 are disposed on theflexible circuit boards 140. The sealing layer 160 encapsulates aperiphery of the flexible display panel 120 and extendedly covers thebonding area 123 and a portion of the flexible circuit boards 140.

More specifically, the flexible display panel 120 in the embodiment maybe a flexible low-temperature polysilicon thin-film-transistor liquidcrystal display panel, a flexible amorphous-Silicon thin-film-transistorliquid crystal display panel, a flexible polycrystalline siliconthin-film-transistor liquid crystal display panel, a flexibleelectrophoretic display panel, or a flexible organic electroluminescentdisplay panel, however, the invention is not limited thereto.

With reference to FIGS. 1A and 1B again, the driving chips 130 of thepresent embodiment are respectively disposed on the flexible circuitboard 140, and the flexible circuit boards 140 are bonded to the bondingarea 123 of the flexible display panel 120 via an anisotropic conductivefilm 150. In other words, the anisotropic conductive film 150 isdisposed between the flexible circuit board 140 and the bonding area 123of the flexible display panel 120, wherein the flexible circuit board140 is electrically connected to the flexible display panel 120 via theanisotropic conductive film 150. Specifically, locations of the drivingchips 130 in the embodiment do not overlap with a location of theflexible display panel 120. The anisotropic conductive film 150 includesan adhesive 152 and a plurality of conductive particles 154. Theconductive particles 154 are distributed in the adhesive 152, wherein adiameter of each of the conductive particles 154 ranges from 1 nm to 5nm. In the embodiment, the driving chips 130 are, for example, signalline driving chip or scan line driving chip, however, the invention isnot limited thereto.

Since the driving chips 130 of the flexible display apparatus 100 a inthe embodiment are disposed on the flexible display panel 120 via theflexible circuit boards 140 (i.e. the chip on film (COF) technique), thedriving chips 130 disposed on the flexible circuit boards 140 are notbended easily (the flexible circuit boards 140 are the one bended bystress). Therefore, the situation in which the pin of a conventionaldriving chip is broken may be avoided. In addition, since the flexibledisplay apparatus 100 a in the embodiment has the sealing layer 160,wherein the sealing layer 160 encapsulates the periphery of the flexibledisplay panel 120 and extendedly covers the bonding area 123 and theflexible circuit boards 140, the sealing layer 160 may reinforce astructure strength between the flexible display panel 120 and theflexible circuit boards 140 so as to further enhance an overallstructural reliability of the flexible display apparatus 100 a. Inbrief, the flexible display apparatus 100 a in the embodiment has ahigher structural reliability.

It needs to be indicated that the reference numbers and a part of thecontent referred in the previous embodiments are recited in thefollowing embodiments, wherein the same reference numbers are used torepresent the same or similar devices, and the description of the sametechnical content is omitted. Please refer to the previous embodimentsfor the omitted description. The same description is not repeated in thefollowing embodiments.

FIG. 2 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention. With referenceto both FIGS. 1A and 2, a flexible display apparatus 100 b in FIG. 2 issimilar to the flexible display apparatus 100 a in FIG. 1A, while themain difference therebetween lies in that the flexible display apparatus100 b in the embodiment further includes a protective layer 180 disposedon a top surface 122 of the flexible display panel 120 for protectingthe top surface 122 of the flexible display panel 120. Herein, thesealing layer 160 covers the flexible circuit board 140 and a portion ofthe protective layer 180. A material of the protective layer 180includes polyethylene terephthalate (PET).

FIG. 3 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention. With referenceto both FIGS. 1A and 3, a flexible display apparatus 100 c in FIG. 3 issimilar to the flexible display apparatus 100 a in FIG. 1A, while themain difference therebetween lies in that the flexible display apparatus100 c in the embodiment further includes a protective layer 190 disposedon a bottom surface 124 of the flexible display panel 120 and coveringthe bottom surface 124 for strengthening the stability of the flexibledisplay panel 120 and providing waterproof function. A material of theprotective layer 190 includes polyethylene terephthalate (PET).

FIG. 4 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention. With referenceto both FIGS. 1A and 4, a flexible display apparatus 100 d in FIG. 4 issimilar to the flexible display apparatus 100 a in FIG. 1A, while themain difference therebetween lies in that the flexible display apparatus100 d in the embodiment further includes a protective layer 180 disposedon a top surface 122 of the flexible display panel 120 for protectingthe top surface 122 of the flexible display panel 120, and a protectivelayer 190 disposed on a bottom surface 124 of the flexible display panel120 for strengthening the stability of the flexible display panel 120and providing waterproof function. Herein, the sealing layer 160 coversthe flexible circuit board 140 and a portion of the protective layer180, and the protective layer 190 completely covers the bottom surface124. A material of the protective layer 180 and a material of theprotective layer 190 include polyethylene terephthalate (PET).

FIG. 5 illustrates a schematic top view of a flexible display apparatusin another embodiment of the invention. With reference to both FIGS. 1Band 5, a flexible display apparatus 100 e in FIG. 5 is similar to theflexible display apparatus 100 a in FIG. 1 B, while the main differencetherebetween lies in that the flexible display apparatus 100 e in theembodiment further includes an external circuit 170, wherein theexternal circuit 170 is connected to a portion of the flexible circuitboards 140 and the flexible display panel 120 is electrically connectedto the external circuit 170 via the flexible circuit boards 140. In theembodiment, the external circuit 170 is, for example, a flexible printedcircuit (FPC) board, but the invention is not limited thereto.

It should be mentioned that the invention provides no limitation to theshape structure and disposition of the external circuit 170. Althoughthe specific shape of the external circuit 170 referred in theembodiment is in a rectangle and is electrically connected only to theportion of the flexible circuit boards 140, in other embodiments, pleaserefer to FIG. 6, a shape of the external circuit 175 of the flexibledisplay apparatus 100 f may also be in an L shape and the externalcircuit 175 is electrically connected to the whole flexible circuitboards 140, which is also an adoptable technical solution in theinvention and does not depart from the scope to be protected in theinvention.

FIG. 7A illustrates a schematic cross-sectional view of a flexibledisplay apparatus in an embodiment of the invention. FIG. 7B illustratesa schematic top view of the flexible display apparatus in FIG. 7A. Withreference to both FIGS. 7A and 7B, a flexible display apparatus 200 a inFIGS. 7A and 7B is similar to the flexible display apparatus 100 a inFIGS. 1A and 1B, while the main difference therebetween lies in that theflexible display apparatus 200 a in the embodiment uses a hot-meltprotective layer 210 instead of the sealing layer 160. In more detail,the hot-melt protective layer 210 in the present embodiment covers thedisplay area 121 and the bonding area 123 of the flexible display panel120 and a portion of the flexible circuit board 140. Herein, a materialof the hot-melt protective layer 210 includes polyethylene terephthalatemixed with a hot-melt material, a weight percentage of the hot-meltmaterial is 30% to 60%, and the hot-melt material includes Polyurethane(PU) or Ethylene-Vinyl Acetate (EVA).

A method of manufacturing the flexible display apparatus 200 a in thepresent embodiment is described as follows. FIGS. 8A to 8E illustrate aschematic cross-sectional view of a manufacturing method of a flexibledisplay apparatus in an embodiment of the invention. As indicated inFIG. 8A, according to the manufacturing method of the flexible displayapparatus 200 a in the embodiment, first of all, a rigid substrate 110is provided, wherein the rigid substrate 110 is, for example, a glasssubstrate or a substrate formed of other appropriate materials for beingused as a supporter.

Next, please refer to both FIGS. 7B and 8A. A flexible display panel 120is formed on the rigid substrate 110, wherein the flexible display panel120 has a display area 121 and a bonding area 123 located outside thedisplay area 121. In the embodiment, a shape of the bonding area 123 ofthe flexible display panel 120 is, for example, in an L shape, however,the invention is not limited thereto.

More specifically, before the flexible display panel 120 is formed onthe rigid substrate 110, an adhesive layer 115 is formed on the rigidsubstrate 110, and the flexible display panel 120 in the embodiment isadhered to the rigid substrate 110 via the adhesive layer 115. In theembodiment, the flexible display panel 120 may be a flexiblelow-temperature polysilicon thin-film-transistor liquid crystal displaypanel, a flexible amorphous-Silicon thin-film-transistor liquid crystaldisplay panel, a flexible polycrystalline silicon thin-film-transistorliquid crystal display panel, a flexible electrophoretic display panel,or a flexible organic electroluminescent display panel, however, theinvention is not limited thereto.

With reference to both FIGS. 7B and 8B, at least one driving chip 130 (aplurality of driving chips are schematically illustrated in FIG. 7B) isbonded to the bonding area 123 of the flexible display panel 120 via atleast one flexible circuit board 140 (a plurality of flexible circuitboards are schematically illustrated in FIG. 7B). In the embodiment, thedriving chips 130 are respectively disposed on the flexible circuitboard 140, and the flexible circuit boards 140 are bonded to the bondingarea 123 of the flexible display panel 120 via an anisotropic conductivefilm 150. The anisotropic conductive film 150 in the present embodimentincludes an adhesive 152 and a plurality of conductive particles 154.The conductive particles 154 are distributed in the adhesive 152,wherein a diameter of each of the conductive particles 154 ranges from 1nm to 5 nm. Specifically, locations of the driving chips 130 in theembodiment do not overlap with a location of the flexible display panel120. In the embodiment, the driving chips 130 are, for example, signalline driving chip or scan line driving chip, however, the invention isnot limited thereto.

With reference to both FIGS. 7B and 8C, a hot-melt protective layer 210is formed on the display area 121 and the bonding area 123 of theflexible display panel 120 and a portion of the flexible circuit board140. Herein, a material of the hot-melt protective layer 210 includespolyethylene terephthalate (PET) mixed with a hot-melt material, aweight percentage of the hot-melt material is 30% to 60%, and thehot-melt material includes Polyurethane (PU) or Ethylene-Vinyl Acetate(EVA).

With reference to both FIGS. 7B and 8D, a heating step is perfoiined tosoften the hot-melt protective layer 210, so that the hot-meltprotective layer 210 adheres to a top surface 122 of the flexibledisplay panel 120 and a portion of the flexible circuit board 140.Herein, a temperature of the heating step is between 70° C. and 140° C.,and a duration of the heating step is between 1 minute and 30 minutes.

Finally, with reference to both FIGS. 7B and 8E, the flexible displaypanel 120 is separated from the rigid substrate 110 to form a flexibledisplay apparatus 200 a, which is the final step of completingmanufacturing the flexible display apparatus 200 a.

Since the flexible display apparatus 200 a in the present embodimentsadopts a chip on film (COF) technique that allows the driving chip 130to be disposed on the flexible display panel 120, when separating theflexible display panel 120 from the rigid substrate 110, the drivingchip 130 disposed on the flexible circuit board 140 is not bended easily(the flexible circuit board 140 is the one bended by stress). Therefore,the situation in which the pin of a conventional driving chip is brokenmay be avoided. In addition, since the flexible display apparatus 200 ain the embodiments of the invention has a hot-melt protective layer 210,wherein the hot-melt protective layer 210 completely covers the displayarea 121 and the bonding area 123 of the flexible display panel 120 andextendedly covers a portion of the flexible circuit board 140, whenseparating the flexible display panel 120 from the rigid substrate 110,the hot-melt protective layer 210 may reinforce a structure strengthbetween the flexible display panel 120 and the flexible circuit board140 so as to further enhance an overall structural reliability of theflexible display apparatus 200 a.

FIG. 9 illustrates a schematic cross-sectional view of a flexibledisplay apparatus in another embodiment of the invention. With referenceto both FIGS. 7A and 9, a flexible display apparatus 200 b in FIG. 9 issimilar to the flexible display apparatus 200 a in FIG. 7A, while themain difference therebetween lies in that the flexible display apparatus200 b in the embodiment further includes a protective layer 220 disposedon a bottom surface 124 of the flexible display panel 120 and coveringthe bottom surface 124 for strengthening the stability of the flexibledisplay panel 120 and providing waterproof function. A material of theprotective layer 220 includes polyethylene terephthalate (PET).

FIG. 10 illustrates a schematic top view of a flexible display apparatusin another embodiment of the invention. With reference to both FIGS. 7Band 10, a flexible display apparatus 200 c in FIG. 10 is similar to theflexible display apparatus 200 a in FIG. 7B, while the main differencetherebetween lies in that the flexible display apparatus 200 c in theembodiment further includes an external circuit 170, wherein theexternal circuit 170 is connected to a portion of the flexible circuitboards 140 and the flexible display panel 120 is electrically connectedto the external circuit 170 via the flexible circuit boards 140. In theembodiment, the external circuit 170 is, for example, a flexible printedcircuit (FPC) board, but the invention is not limited thereto.

It should be mentioned that the invention provides no limitation to theshape structure and disposition of the external circuit 170. Althoughthe specific shape of the external circuit 170 referred in theembodiment is in a rectangle and is electrically connected only to theportion of the flexible circuit boards 140, in other embodiments, pleaserefer to FIG. 11, a shape of the external circuit 175 of the flexibledisplay apparatus 200 d may also be in an L shape and the externalcircuit 175 is electrically connected to the whole flexible circuitboards 140, which is also an adoptable technical solution in theinvention and does not depart from the scope to be protected in theinvention.

To sum up, since the flexible display apparatus in the embodiments ofthe invention adopts a chip on film (COF) technique that allows thedriving chip to be disposed on the flexible display panel, the drivingchip disposed on the flexible circuit board is not bended easily (theflexible circuit board is the one bended by stress). Therefore, thesituation in which the pin of a conventional driving chip is broken maybe avoided. In addition, since the flexible display apparatus in theembodiments of the invention has a sealing layer or a hot-meltprotective layer, when separating the flexible display panel from therigid substrate, the sealing layer or the hot-melt protective layer mayreinforce a structure strength between the flexible display panel andthe flexible circuit board so as to further enhance an overallstructural reliability of the flexible display apparatus.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of thedisclosed embodiments without departing from the scope or spirit of theinvention. In view of the foregoing, it is intended that the disclosurecover modifications and variations of this specification provided theyfall within the scope of the following claims and their equivalents.

What is claimed is:
 1. A flexible display apparatus, comprising: aflexible display panel having a display area and a bonding area locatedoutside the display area; a flexible circuit board disposed in thebonding area of the flexible display panel; a driving chip disposed onthe flexible circuit board; and a sealing layer encapsulating aperiphery of the flexible display panel and extendedly covering thebonding area and a portion of the flexible circuit board.
 2. Theflexible display apparatus as recited in claim 1, further comprising: ananisotropic conductive film disposed between the flexible circuit boardand the bonding area of the flexible display panel, wherein the flexiblecircuit board is electrically connected to the flexible display panelvia the anisotropic conductive film.
 3. The flexible display apparatusas recited in claim 2, wherein the anisotropic conductive filmcomprising: an adhesive; and a plurality of conductive particlesdistributed in the adhesive, wherein a diameter of each of theconductive particles ranges from 1 nm to 5 nm.
 4. The flexible displayapparatus as recited in claim 1, wherein a location of the driving chipdoes not overlap with a location of the flexible display panel.
 5. Theflexible display apparatus as recited in claim 1, further comprising: anexternal circuit connected to the flexible circuit board, wherein theflexible display panel is electrically connected to the external circuitvia the flexible circuit board.
 6. The flexible display apparatus asrecited in claim 1, further comprising: a protective layer disposed on abottom surface of the flexible display panel and covering the bottomsurface.
 7. The flexible display apparatus as recited in claim 1,further comprising: a protective layer disposed on a top surface of theflexible display panel, and the sealing layer covering the flexiblecircuit board and the protective layer.
 8. A flexible display apparatus,comprising: a flexible display panel having a display area and a bondingarea located outside the display area; a flexible circuit board disposedin the bonding area of the flexible display panel; a driving chipdisposed on the flexible circuit board; and a hot-melt protective layercovering the display area and the bonding area of the flexible displaypanel and a portion of the flexible circuit board.
 9. The flexibledisplay apparatus as recited in claim 8, further comprising: ananisotropic conductive film disposed between the flexible circuit boardand the bonding area of the flexible display panel, wherein the flexiblecircuit board is electrically connected to the flexible display panelvia the anisotropic conductive film.
 10. The flexible display apparatusas recited in claim 9, wherein the anisotropic conductive filmcomprising: an adhesive; and a plurality of conductive particlesdistributed in the adhesive, wherein a diameter of each of theconductive particles ranges from 1 nm to 5 nm.
 11. The flexible displayapparatus as recited in claim 8, wherein a location of the driving chipdoes not overlap with a location of the flexible display panel.
 12. Theflexible display apparatus as recited in claim 8, further comprising: anexternal circuit connected to the flexible circuit board, wherein theflexible display panel is electrically connected to the external circuitvia the flexible circuit board.
 13. The flexible display apparatus asrecited in claim 8, further comprising: a protective layer disposed on abottom surface of the flexible display panel and covering the bottomsurface.
 14. The flexible display apparatus as recited in claim 13,wherein a material of the protective layer comprising polyethyleneterephthalate.
 15. The flexible display apparatus as recited in claim 8,wherein a material of the hot-melt protective layer comprisespolyethylene terephthalate mixed with a hot-melt material, a weightpercentage of the hot-melt material is 30% to 60%, and the hot-meltmaterial comprises Polyurethane or Ethylene-Vinyl Acetate.
 16. Amanufacturing method of a flexible display apparatus, comprising:providing a substrate; forming a flexible display panel on thesubstrate, wherein the flexible display panel has a display area and abonding area located outside the display area; bonding a driving chip onthe bonding area of the flexible display panel via at least one flexiblecircuit board; forming a hot-melt protective layer on the display areaand the bonding area of the flexible display panel and a portion of theflexible circuit board; performing a heating step to soften the hot-meltprotective layer; and separating the flexible display panel from thesubstrate.
 17. The manufacturing method of the flexible displayapparatus as recited in claim 16, wherein the step of forming theflexible display panel on the substrate comprises: forming an adhesivelayer on the substrate; and forming the flexible display panel on thesubstrate, wherein the flexible display panel is adhered to thesubstrate via the adhesive layer.
 18. The manufacturing method of theflexible display apparatus as recited in claim 16, wherein the drivingchip is disposed on the flexible circuit board, and a location of thedriving chip does not overlap with a location of the flexible displaypanel.
 19. The manufacturing method of the flexible display apparatus asrecited in claim 16, wherein the flexible circuit board is bonded to thebonding area of the flexible display panel via an anisotropic conductivefilm.
 20. The manufacturing method of the flexible display apparatus asrecited in claim 16, further comprising: after separating the flexibledisplay panel from the substrate, bonding an external circuit to theflexible circuit board, wherein the flexible display panel iselectrically connected to the external circuit via the flexible circuitboard.
 21. The manufacturing method of the flexible display apparatus asrecited in claim 16, wherein a temperature of the heating step isbetween 70° C. and 140° C.
 22. The manufacturing method of the flexibledisplay apparatus as recited in claim 16, further comprising: afterseparating the flexible display panel from the substrate, bonding aprotective layer to a bottom surface of the flexible display panel.